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 2001.4.11
Ver. 2.0
MITSUBISHI LSIs
M5M5W816TP-70HI, 85HI
PRELIMINARY
Notice: This is not a final specification. Some parametric limits are subject to change
8388608-BIT (524288-WORD BY 16-BIT) CMOS STATIC RAM
Those are summarized in the part name table below.
DESCRIPTION
The M5M5W816TP is a f amily of low v oltage 8-Mbit static RAMs organized as 524288-words by 16-bit, f abricated by Mitsubishi's high-perf ormance 0.18m CMOS technology . The M5M5W816TP is suitable f or memory applications where a simple interf acing , battery operating and battery backup are the important design objectiv es. The M5M5W816TP is packaged in a 44pin thin small outline mount dev ice, with the outline of 400mil TSOP TY PE(II). It giv es the best solution f or a compaction of mounting area as well as f lexibility of wiring pattern of printed circuit boards. The operating temperature range is -40~+85C Version, Operating temperature Part name -
FEATURES
Single 2.7~3.0V power supply Small stand-by current: 0.2A (3.0V, ty p.) No clocks, No ref resh Data retention supply v oltage =2.0V All inputs and outputs are TTL compatible. Easy memory expansion by S#, BC1# and BC2# Common Data I/O Three-state outputs: OR-tie capability OE# prev ents data contention in the I/O bus Process technology : 0.18m CMOS Package: 44pin 400mil TSOP TYPE(II)
Power Supply
Access time
max.
70ns
Stand-by c urrent Ratings (max.) * Ty pical 25C 40C 25C 40C 70C 85C 0.5 1.0 2 4 20 40
Activ e current Icc1 *(ty p.)
40mA (10MHz) 5mA (1MHz)
I-version
-40~+85C
M5M5W816TP -70HI 2.7~3.0V M5M5W816TP -85HI
85ns
* Typical parameter indicates the value for the center of distribution, and not 100% tested.
PIN CONFIGURATION
A4 A3 A2 A1 A0 S# DQ1 DQ2 DQ3 DQ4
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22
44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23
A5 A6 A7 OE# BC2# BC1# DQ16 DQ15 DQ14 DQ13 GND
Pin A0 ~ A18 S# W# OE# BC1# BC2# Vcc GND
Function Address input Chip select input Write control input Output enable input Lower By te (DQ1 ~ 8) Upper By te (DQ9 ~ 16) Power supply Ground supply
DQ1 ~ DQ16 Data input / output
VCC
GND DQ5 DQ6 DQ7 DQ8 W# A15 A14 A13 A12 A16
VCC
DQ12 DQ11 DQ10 DQ9 A18 A8 A9 A10 A11 A17
44Pin 400mil TSOP
Outline: 44P3W NC: No Connection
MITSUBISHI ELECTRIC
1
2001.4.11
Ver. 2.0
MITSUBISHI LSIs
M5M5W816TP-70HI, 85HI
FUNCTION
The M5M5W816TP is organized as 524288-words by 16bit. These dev ices operate on a single +2.7~3.0V power supply , and are directly TTL compatible to both input and output. Its f ully s t atic circuit needs no clocks and no ref resh, and makes it usef ul. The operation mode are determined by a combination of the dev ice control inputs BC1# , BC2# , S# , W# and OE#. Each mode is summarized in the f unction table. A write operation is executed whenev er the low lev el W# ov erlaps with the low lev el BC1# and/or BC2# and the low lev el S#. The address(A0~A18) must be set up bef ore the write cy c le and must be stable during the entire cy c le. A read operation is executed by s etting W# at a high lev el and OE# at a low lev el while BC1# and/or BC2# and S# are in an activ e state(S#=L). When setting BC1# at the high lev el and other pins are in an activ e stage , upper-by t e are in a selectable mode in which both reading and writing are enabled, and lower-by t e are in a non-selectable mode. And when setting BC2# at a high lev el and other pins are in an activ e stage, lowerby t e are in a selectable mode and upper-by te are in a non-selectable mode. The operating temperature range is -40 ~ +85C
PRELIMINARY
Notice: This is not a final specification. Some parametric limits are subject to change
8388608-BIT (524288-WORD BY 16-BIT) CMOS STATIC RAM
When setting BC1# and BC2# at a high lev el or S# at a high lev el, the chips are in a non-selectable mode in which both reading and writing are disabled. In this mode, the output stage is in a high-impedance state, allowing OR-tie with other chips and memory expansion by BC1#, BC2# and S#. The power supply c urrent is reduced as low as 0.1A(25C, ty pical), and the memory data can be held at +2.0V power supply , enabling battery back-up operation during power f ailure or power-down operation in the non-selected mode.
FUNCTION TABLE
S# BC1# BC2# W# OE#
Mode
Non selection Non selection
DQ1~8
DQ9~16
H X L L L L L L L L L
X H L L L H H H L L L
X H H H H L L L L L L
X X L H H L H H L H H
X X X L H X L H X L H
Write Read Write Read Write Read
High-Z High-Z Din Dout High-Z High-Z High-Z High-Z Din Dout High-Z
Icc High-Z Standby High-Z Standby High-Z Activ e High-Z Activ e High-Z Activ e Din Activ e Dout Activ e High-Z Activ e Din Activ e Dout Activ e High-Z Activ e
BLOCK DIAGRAM
A0 A1 MEMORY ARRAY 524288 WORDS x 16 BITS A17 A18
CLOCK GENERATOR -
DQ 1
DQ 8
DQ 9
S#
DQ 16
BC1#
BC2#
Vcc
W# GND
OE#
MITSUBISHI ELECTRIC
2
2001.4.11
Ver. 2.0
MITSUBISHI LSIs
M5M5W816TP-70HI, 85HI
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Supply v oltage Input v oltage Output v oltage Power dissipation Operating temperature Storage temperature Conditions With respect to GND With respect to GND With respect to GND Ta= 25C
PRELIMINARY
Notice: This is not a final specification. Some parametric limits are subject to change
8388608-BIT (524288-WORD BY 16-BIT) CMOS STATIC RAM
Ratings
Units
Vcc VI VO Pd Ta T stg
-0.3* ~ +4.6 -0.3* ~ Vcc + 0.3 (max. 4.6V) 0 ~ Vcc 700 - 40 ~ +85 - 65 ~ +150
* -3.0V in case of AC (Pulse width < 30ns) =
V mW
C C
DC ELECTRICAL CHARACTERISTICS
Symbol
( Vcc=2.7 ~ 3.0V, unless otherwise noted) Limits Min 2.2 Ty p Max Vcc+0.2V Units
Parameter High-lev el input v oltage Low-lev el input v oltage
High-level output voltage
Conditions
VIH VIL VOH VOL II IO
Low-lev el output v oltage Input leakage current Output leakage current ( AC,MOS lev el )
IOH= - 0.5mA IOL=2mA VI =0 ~ Vcc
BC1# and BC2#=VIH or S#=VIH or OE#=VIH, VI/O=0 ~ Vcc < BC1# and BC2# = 0.2V, S# < 0.2V = > other inputs < 0.2V or = Vcc-0.2V = Output - open (duty 100%)
-0.2 * 2.4
0.6 0.4 1 1 40 10 40 10 2 4 20 40 2
V
A
Icc1 Activ e supply c urrent
f = 10MHz f = 1MHz f = 10MHz f = 1MHz ~ +25C ~ +40C ~ +70C ~ +85C
Activ e supply c urrent Icc2 ( AC,TTL lev el )
BC1# and BC2#=V IL , S#=V IL other pins =V IH or VIL Output - open (duty 100%) (1) S# = Vcc - 0.2V, > other inputs = 0 ~ Vcc
-
30 5 30 5 0.5 1.0 -
mA
Icc3 Stand by s upply current
( AC,MOS lev el )
(2) BC1# and BC2# = Vcc - 0.2V > S# < 0.2V = other inputs = 0 ~ Vcc
A
Icc4
Stand by s upply current ( AC,TTL lev el )
BC1# and BC2#=VIH or S#=VIH Other inputs= 0 ~ Vcc
mA
Note 1: Direction for current flowing into IC is indicated as positive (no mark)
* -3.0V in case of AC (Pulse width < 30ns) =
Note 2: Typical parameter indicates the value for the center of distribution at 3.0V, and not 100% tested.
CAPACITANCE
Symbol
(Vcc=2.7 ~3.0V, unless otherwise noted) Conditions Min VI=GND, VI=25mVrms, f =1MHz VO=GND,VO=25mVrms, f =1MHz Limits Ty p Units
Parameter Input capacitance Output capacitance
Max
CI CO
10 10
pF
MITSUBISHI ELECTRIC
3
2001.4.11
Ver. 2.0
MITSUBISHI LSIs
M5M5W816TP-70HI, 85HI
AC ELECTRICAL CHARACTERISTICS (1) TEST CONDITIONS
Supply v oltage
PRELIMINARY
Notice: This is not a final specification. Some parametric limits are subject to change
8388608-BIT (524288-WORD BY 16-BIT) CMOS STATIC RAM
(Vcc=2.7 ~3.0V, unless otherwise noted)
2.7~3.0V Input pulse VIH=2.4V, VIL=0.4V Input rise time and f all time 5ns
Ref erence lev el Output loads
1TTL DQ CL
Including scope and jig capacitance
VOH=VOL=1.5V
Transition is measured 200mV from steady state voltage.(for ten,tdis)
Fig.1,CL=30pF CL=5pF (for ten,tdis)
Fig.1 Output load
(2) READ CYCLE
Limits Symbol tCR Parameter Read cy cle time Min 70 70HI Max 70 70 70 70 35 25 25 25 25 10 5 5 10 10 5 5 10 Min 85 85HI Max 85 85 85 85 45 30 30 30 30 ns ns ns ns ns ns ns ns ns ns ns ns ns ns Units
ta(A) Address access time ta(S) Chip select 1 access time ta(BC1) By te control 1 access time ta(BC2) By te control 2 access time ta(OE) Output enable access time tdis (S) Output disable time af t er S# high tdis (BC1) Output disable time af t er BC1# high tdis (BC2) Output disable time af t er BC2# high tdis (OE) Output disable time af t er OE# high ten(S) Output enable time af ter S# low ten(BC1,2) Output enable time af ter BC1#,BC2# low ten(OE) Output enable time af ter OE# low tV(A) Data v alid time after address
*5ns in case of using either BC1# or BC2#
(3) WRITE CYCLE
Limits Symbol Parameter Write cy cle time Write pulse width Address setup time Address setup time with respect to W# By te control 1 setup time By te control 2 setup time Chip select setup time Data setup time Data hold time Write recov ery time Output disable time f rom W# low Output disable time f rom OE# high Output enable time f rom W# high Output enable time f rom OE# low 70HI Min 70 55 0 65 65 65 65 35 0 0 Max 85HI Min 85 60 0 70 70 70 70 45 0 0 Max ns ns ns ns ns ns ns ns ns ns ns ns ns ns Units
tCW tw(W) tsu(A) tsu(A-WH) tsu(BC1) tsu(BC2) tsu(S) tsu(D) th(D) trec(W) tdis (W) tdis (OE) ten(W) ten(OE)
25 25 5 5 5 5
30 30
MITSUBISHI ELECTRIC
4
2001.4.11
Ver. 2.0
MITSUBISHI LSIs
M5M5W816TP-70HI, 85HI
(4)TIMING DIAGRAMS Read cycle
A0~18 ta(A) ta(BC1) or ta(BC2)
BC1#,BC2# (Note3)
PRELIMINARY
Notice: This is not a final specification. Some parametric limits are subject to change
8388608-BIT (524288-WORD BY 16-BIT) CMOS STATIC RAM tCR
tv (A)
tdis (BC1) or tdis (BC2) ta(S)
(Note3)
S#
(Note3)
tdis (S) ta (OE)
(Note3)
OE#
(Note3) W# = "H" lev el
ten (OE) ten (BC1) ten (BC2) ten (S)
tdis (OE)
(Note3)
DQ1~16
VALID DATA
Write cycle ( W# control mode )
A0~18
tCW
tsu (BC1) or tsu(BC2)
BC1#,BC2# (Note3) (Note3)
S#
(Note3)
tsu (S)
(Note3)
OE# tsu (A) W# tdis(OE) DQ1~16
tsu (A-WH) tw (W) tdis (W)
trec (W) ten(OE) ten (W)
DATA IN STABLE
tsu (D)
th (D)
MITSUBISHI ELECTRIC
5
2001.4.11
Ver. 2.0
MITSUBISHI LSIs
M5M5W816TP-70HI, 85HI
Write cycle (BC# control mode)
A0~18 tsu (A)
BC1#,BC2#
PRELIMINARY
Notice: This is not a final specification. Some parametric limits are subject to change
8388608-BIT (524288-WORD BY 16-BIT) CMOS STATIC RAM
tCW
tsu (BC1) or tsu (BC2)
trec (W)
S#
(Note3) (Note5) (Note3)
W#
(Note3)
(Note4) (Note3)
tsu (D) DQ1~16
DATA IN STABLE
th (D)
Note 3: Hatching indicates the state is "don't care". Note 4: A Write occurs during S# low ov erlaps BC1# and/or BC2# low and W# low. Note 5: When the f alling edge of W# is simultaneously or prior to the f alling edge of BC1# and/or BC2# or the f alling edge of S#, the outputs are maintained in the high impedance state. Note 6: Don't apply inv erted phase signal externally when DQ pin is in output mode.
MITSUBISHI ELECTRIC
6
2001.4.11
Ver. 2.0
MITSUBISHI LSIs
M5M5W816TP-70HI, 85HI
Write cycle (S# control mode)
A0~18 tCW
PRELIMINARY
Notice: This is not a final specification. Some parametric limits are subject to change
8388608-BIT (524288-WORD BY 16-BIT) CMOS STATIC RAM
BC1#, BC2# (Note3)
tsu (A)
tsu (S)
trec (W)
(Note3)
S#
(Note5)
W#
(Note3)
(Note4)
tsu (D)
DATA IN STABLE
th (D)
(Note3)
DQ1~16
MITSUBISHI ELECTRIC
7
2001.4.11
Ver. 2.0
MITSUBISHI LSIs
M5M5W816TP-70HI, 85HI
POWER DOWN CHARACTERISTICS (1) ELECTRICAL CHARACTERISTICS
Symbol Vcc Parameter Test conditions
PRELIMINARY
Notice: This is not a final specification. Some parametric limits are subject to change
8388608-BIT (524288-WORD BY 16-BIT) CMOS STATIC RAM
Min
Limits Ty p
Max
Units V V V
(PD) Power down supply voltage Byte control input BC1# & BC2#
2.0 2.0 2.0
Vcc=2.0V
VI (BC)
VI (S)
Chip select input S#
~ +25C ~ +40C ~ +70C ~ +85C
Icc
(PD)
Power down supply c urrent
> (1) S# = Vcc - 0.2V,
other inputs = 0 ~ Vcc
-
0.1 0.2 -
1.5 3 15 30 A
> (2) BC1# and BC2#= Vcc - 0.2V S# < 0.2V = other inputs = 0 ~ Vcc
Note 2: Typical parameter of Icc(PD) indicates the value for the center of distribution at 2.0V, and not 100% tested.
(2) TIMING REQUIREMENTS
Symbol Parameter Power down set up time Power down recov ery t ime Limits Test conditions Min Ty p Max Units ns ms
tsu (PD) trec (PD)
0 5
(3) TIMING DIAGRAM
BC# control mode Vcc tsu (PD) 2.2V BC1# BC2# BC1# , BC2# > Vcc-0.2V = 2.7V 2.7V trec (PD) 2.2V
S# control mode Vcc tsu (PD) 2.2V S# S# > Vcc-0.2V = 2.7V 2.7V trec (PD) 2.2V
MITSUBISHI ELECTRIC
8
Keep safety first in your circuit designs!
Mitsubishi Electric Corporation puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of non-flammable material or (iii) prevention against any malfunction or mishap.
Notes regarding these materials
These materials are intended as a reference to assist our customers in the selection of the Mitsubishi semiconductor product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Mitsubishi Electric Corporation or a third party. Mitsubishi Electric Corporation assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Mitsubishi Electric Corporation without notice due to product improvements or other reasons. It is therefore recommended that customers contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Mitsubishi Electric Corporation assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Mitsubishi Electric Corporation by various means, including the Mitsubishi Semiconductor home page (http://www.mitsubishichips.com). When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Mitsubishi Electric Corporation assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. Mitsubishi Electric Corporation semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. The prior written approval of Mitsubishi Electric Corporation is necessary to reprint or reproduce in whole or in part these materials. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. Please contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor for further details on these materials or the products contained therein.
9
MITSUBISHI ELECTRIC


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